November 16, 2007ArsTechnica’s Xbox360 Falcon Dissection and Power Consumption
Posted by The Ori
Little has actually changed with the internal design of the console, obviously some components have changed (e.g. DRAM) but the general layout remains the same after two years.
Here’s what’s interesting: the CPU, GPU and eDRAM die all seem to have gotten smaller, but at different rates. The CPU sees the biggest reduction in size, the new core being about 75% the size of the old one, while both GPU components are around 85% the size of their predecessors.
It’s possible that all three chips are now 65nm, or a mixture of 65nm and 80nm (TSMC’s 80nm half-node process was used in ATI’s R600 GPU). Needless to say, the chips are all smaller, which should yield some nice power savings.
The power savings of the new Xbox are dramatic, if you consider 53 watts less power use, dramatic.
Full Story: anandtech.com (6 pages)
Does this mean it won’t overheat? :O
Not necessarily, you still have the GPU, which IS the problem in the first place. You would figure they’d go for the problem chip, and make that 65nm, but no, as backwards as usual, they do the CPU. It does reduce the overall ambient temp inside the unit, but the GPU will still generate the same heat as before.
this is so wrong, the GPU is smaller, it’s now 80nm and the only thing that made the Xbox 360 breaks a lot was the OVERHEATING, not the GPU, not the CPU, but generally the OVERHEATING.
I think the Falcon new mb will reduce the RROD to something normal, like 1-9%.
I’m waiting for it.
Actually it was a combination of the overheating, plus the X-Clamps providing a flex in the MoBo witch caused the solder joints to come apart.
-ShaX5