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Here are some pictures by JWSpeed of the xbox forums of the inside of the Xbox360 with a new CPU heatsink. The motherboard looks (almost) identical to the Zephyr, so it is doubtful that it’s the Falcon revision. If the CPU is 65nm or not is hard to say, it seems to be a bit different to those in the Pro-hdmi or Elite ones anyway. The smaller package, the lower power usage (displayed below) and missing ‘power converters’ on the right side of the board would seem to indicate it is a 65nm CPU.

While the newer heatsink loses the copper heatpipe, it seems bigger/larger than the old CPU heatsink. So it might cool off the CPU as well as the old one (the CPU has never really been the issue anyway, it’s the GPU that overheats). However, by removing the heatpipe in the middle of the CPU heatsink, the airflow is probably better for the ‘addon’ GPU heatsink, and, we all know that chip can use more cooling. Maybe that’s why they changed it?

*Update* About the X-Clamps, his is what JWSpeed said:
“MS is now using the heatsink with a X spring clamp on the bottom, plus 4 screws to hold the heatsink down. IMO this looks like a good setup and should keep the GPU in place.” Please note that not all Halo3 LEs are like this, it seems to start somewhere at lot #734 (the end of august MFG date); you can find the lot# on the side sticker of the H# Edition box.

PICTURES

The CPU under the new heatsink. (to compare, this one has been used in the Elite so far)

Motherboard seems identical to Zephyr (Elite/Pro-HDMI). New CPU heatsink is a bit larger than old one.

Elite (Top @ 0.10) and Halo3 LE lot734 (Bottom @ 0.06) power usage (amps) in dashboard